3 Review(s)

This heat sink paste (Syringe) is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, thereby increasing the overall efficiency of the component / device. Features: 1.High Grade Stability And Reliability. 2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components. 3.Helps Disperse The Heat From CPU To Heatsink Effectively. 4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer. 5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive. Specification: 1.Model: HY510 2.Thermal Conductivity: >1.93 W/m-K 3.Thermal Resistance: <0.225° C-in?2;/W 4.Color: Grey 5.Net Weight: 30g.