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Amaoe EU2 BGA Reballing Stencil for Samung Exynos CPU – High Precision Stencil for Mobile Chip Repair (EXY7580, EXY8895 A/B, EXY9810, EXY3470, EXY3475, EXY7570, EXY7880, EXY7580)The Amaoe EU2 BGA Reballing Stencil is a professional-grade planting tin net repair tool designed specifically for Samung Exynos processors. Whether you are reballing EXY9810, EXY8895 A/B, EXY7880, EXY7580, EXY7570, EXY3470, or EXY3475 chips, this stencil ensures pinpoint accuracy, unmatched durability, and a flawless soldering experience. Designed for BGA chip rework and IC planting, this stencil is an essential addition to any advanced mobile repairing toolkit.This Amaoe EU2 BGA reballing stencil is specially created for solder paste application and solder ball replanting on BGA chips during rework. Whether you're fixing a damaged Exynos IC or replacing an old CPU, this planting tin net stencil allows for ultra-precise deposition of solder paste or balls. Ideal for mobile repair professionals, technicians, and advanced DIYers working on Samung chipsets.