3 Review(s)

Take your mobile repairing game to the next level with the Amaoe MU-1 BGA Reballing Stencil, a professional-grade tool engineered for MTK CPU chip IC reballing. Crafted specifically for technicians working on MediaTek chipsets like MT6795W, MT6797W, MT6595, MT6732, and MT6750, this stencil delivers precise alignment and flawless reballing every single time.Amaoe MU-1 stencil for MTK CPU is made from premium-grade 0.12mm stainless steel, offering superior heat resistance, long-lasting durability, and repeat-use performance even under extreme soldering temperatures. Its micro-drilled apertures provide accurate solder ball placement, minimizing error and enhancing rework efficiency on BGA components.Whether you're a mobile repair expert or a technician handling MTK IC chip repairs, this tin planting mesh stencil guarantees precise solder paste or tin ball application, ensuring the CPU is securely and cleanly reballed back to the PCB.Choosing the Amaoe MU-1 BGA stencil means trusting a tool built for precision, speed, and versatility. Designed for professional mobile phone technicians, this stencil cuts down your reballing time while increasing accuracy and reducing material wastage.This tool isn’t just a mesh—it’s a professional rework stencil that makes MTK chip soldering fast, clean, and consistent.