3 Review(s)

Upgrade your mobile repairing setup with the AMAOE OV-4 BGA Reballing Stencil, the go-to professional-grade CPU power chip IC stencil for Oppo A52, K3, RENO R17 Pro, Vivo NEX, Z5X, Y50, and Snapdragon chipsets like SM6150, SDM710, and SDM665. Whether you're reballing or applying solder paste, this stencil is crafted for precision, durability, and perfect alignment—a must-have tool for advanced SMD rework and BGA chip repair.Why Choose AMAOE OV-4 Reballing Stencil?In the world of micro-soldering and BGA repair, accuracy is everything. The AMAOE OV-4 stencil gives you the edge with its micron-level aperture precision, ensuring flawless placement of solder paste or solder balls on even the smallest CPU power chip ICs. Ideal for technicians and mobile repair shops working on Snapdragon processors, Vivo and Oppo smartphones, and complex PCB boards, this stencil minimizes error and maximizes efficiency.Unlike low-grade stencils that deform or wear out after a few uses, this stencil is engineered from high-grade stainless steel, making it heat-resistant, rust-proof, and extremely durable. It stands up to repeated high-temperature applications without losing shape, giving you consistent performance every time.Trusted by Mobile Technicians Across IndiaProfessionals across India trust AMAOE for its consistent quality, advanced design, and reliability in the field of BGA rework, IC replacement, and SMD repairs. When you're handling delicate Snapdragon CPUs and flagship mobile boards, you need a stencil that performs like a pro.