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The AMAOE MI-13 CPU BGA Reballing Stencil is a high-quality, precision-engineered BGA reballing stencil crafted for mobile motherboard technicians, IC repair experts, and professional reballers. This AMAOE MI:13 stencil is specifically designed for advanced reballing tasks on a wide variety of chips and CPU models, including VC7643, 77040, BGA254, 78190, VC7916, QPM5541, QPM5579, WCN3991, SMB1395, PM6350, PM6150L, PM7250B, SM7225 CPU, 100TB28, PMI632, SDR375, MT6358W, PM4250, MT6177, WTR3925, SMB1351, and more.Engineered using high-grade stainless steel, the stencil is heat-resistant and built for repeated use under extreme soldering conditions, ensuring accuracy and longevity in your BGA reballing workflow.If you're a professional mobile repair engineer, you understand the importance of having the right tools to perform delicate BGA CPU rework. The AMAOE MI-13 stencil is not just another stencil—it's a trusted companion that ensures your soldering, IC installation, and motherboard chip reballing work is clean, accurate, and reliable. Whether you're working on SM7225 CPU, PM7250B, or MT6177, this stencil guarantees perfect reball placement every time.The AMAOE MI-13 BGA Reballing Stencil is your go-to solution for high-efficiency, high-precision BGA reballing and soldering work. Built for experts who demand performance and accuracy, this stencil delivers consistent results across a wide range of mobile CPUs and power ICs. Boost your repair workflow, save time, and ensure every chip is soldered to perfection.