3 Review(s)

Specification : ? Substrate material : Polyimide polymers. ? Glue Type: Silicone Substrate Material: 0.002 in. ? Thickness with adhesive: 0.002 in. ? Size: 10mm x 100 ft. ? Elongation : 35% temperature range: -73ºC - 500.0 ° F (-99 ° F - 500 ° F) Applications: ? Automotive sensor and fiber optic. ? Etching insulating circuit board collectors. ? High temperature wire powder coating. ? Semiconductor manufacturing. ? Wave soldering during circuit board assembly.