DHRUV-PRO RMA-218 New Kingbo 100G Bga Soldering Flux Solder Paste 30 W Temperature Controlled(Round Tip)
      
      
 
 
 
    
 
        
     
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  The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA rebelling / balls worksite can stick the balls much more.