Electronics Product Design for SPPU 19 Course (BE - SEM VII - E&Tc - 404185(B)) - ELECTIVE - IV(Paperback, V.S. BAGAD, RANA S. MAHAJAN) | Zipri.in
Electronics Product Design for SPPU 19 Course (BE - SEM VII - E&Tc - 404185(B)) - ELECTIVE - IV(Paperback, V.S. BAGAD, RANA S. MAHAJAN)

Electronics Product Design for SPPU 19 Course (BE - SEM VII - E&Tc - 404185(B)) - ELECTIVE - IV(Paperback, V.S. BAGAD, RANA S. MAHAJAN)

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Unit IIntroduction to Electronic Product DesignOverview of System Engineering, System Perspectives, Documentation, Concept Development, Requirements, Design Development, Rapid Prototyping And Field Testing, Validation, Verification and Integration, Maintenance and Life Cycle Costs, Failure, Iteration and Judgment, Good Engineering, Architecturing, Design Concerns and Heuristics, Teamwork and Trust. (Chapter - 1)Unit IICircuit Design and Testing MethodsFrom Symbols To Substance, Convert Requirements Into Design, Reliability, Fault Tolerance, High Speed Design, Low Power Design, Noise And Error Budget, Standard Data Buses And Networks, Reset And Power Failure Detection, Interface : Inputs, Outputs, Breadboards, Evaluation Boards And Prototypes. (Chapter - 2)Unit IIISoftware Design and Testing MethodsTypes Of Software, Traditional Software Life Cycle, Models, Metrics and Software Limitations, Risk Abatement and Failure Preventions, Software Bugs and Testing, Good Programming Practice, User Interface, Embedded, Real Time Software, Case Studies and Design Examples. (Chapter - 3)Unit IVPCB DesignCircuit Boards, Component Placement, Routing Signal Traces, Grounds, Returns and Shields, Connectors and Cables, Design for Manufacture, Testing and Maintenance, Power Conversion Choices, Power Distribution, Line Conditioning, Electromagnetic Interference, Heat Transfer, Mechanisms For Cooling, Heat Sink Selection, Heat Pipes and Thermal Pillows, Fans and Forced Cooling, Liquid Cooling, Evaporation and Refrigeration, Trade-Offs in Design. (Chapter - 4)Unit VProduct Debugging and TestingSteps Of Debugging, Techniques for Troubleshooting, Characterization, Electromechanical Components, Passive Components, Active Components, Active Devices, Operational Amplifier, Analog-Digital Conversion, Digital Components, Inspection and Test Of Components, Simulation, Prototyping and Testing, Integration, Validation and Verification. Procurement, Manufacturing, Maintenance and Repair. (Chapter - 5)Unit VIDocumentationDefinition, Need, Types of Documentation, Records, Accountability and Liability. Audience. Preparation, Presentation, Preservation of Documents. Methods of Documentation, Visual Techniques, Layout of Documentation, Bill of Material. (Chapter - 6)