LapWizard Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets Liquid Metal Based Thermal Paste(30 g 6 W/mK) | Zipri.in
LapWizard Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets Liquid Metal Based Thermal Paste(30 g 6 W/mK)

LapWizard Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets Liquid Metal Based Thermal Paste(30 g 6 W/mK)

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Superior Heat Dissipation: Engineered with carbon micro-particles, our thermal paste ensures exceptional thermal conductivity, rapidly dissipating heat from your CPU, GPU, or chipsets. This high-performance compound maximizes the efficiency of your cooling system, keeping your devices running smoothly and extending their lifespan.Safe and Reliable: Our thermal paste is metal-free and electrically non-conductive, offering peace of mind by eliminating the risk of short circuits. Whether you're a professional or a DIY enthusiast, this paste provides a secure application, protecting your valuable components.Easy Application for All Users: Designed with an ideal consistency, this thermal paste is easy to apply, ensuring even beginners can achieve a flawless spread. Packaged in a convenient injection-style syringe, it allows for precise application, guaranteeing that the paste stays where you need it.Wide Temperature Range: Resistant to temperatures ranging from 30°C to 60°C, this paste maintains its stability under extreme conditions. It’s perfect for overclocking and demanding computing tasks, ensuring continuous performance without the need for reapplication over the years.Versatile Compatibility: Ideal for a variety of applications, from CPUs and GPUs to diodes and rectifiers. This high-performance thermal compound ensures a strong thermal coupling, enhancing the heat transfer between electronic components and heat sinks, thus boosting the overall efficiency of your devices.