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Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component/ device. Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications. Features: High Thermal Conductivity Low Thermal Resistance Electrically Non-Conductive Non-Curing Non-Capacities Non-Corrosive Bleed resistant Temp resistant from -50 to 210 deg C.