Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies(English, Paperback, Chapman Gilbert B II) | Zipri.in
  • Home /
  • Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies(English, Paperback, Chapman Gilbert B II)
Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies(English, Paperback, Chapman Gilbert B II)

Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies(English, Paperback, Chapman Gilbert B II)

3 Review(s)

Quick Overview

Rs.3904 on FlipkartBuy
Product Price Comparison
Rs.₹10699
Search similar
Buy from Shopclues