PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK) | Zipri.in
PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK)

PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK)

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•Place over the area you want to protect from hot air and Fits for PCB, Mother board, electronics board, IC SMD DIP and etc.•Great safety and stability: electrical insulation, in -40 C - 200 C will not melt. Wear Resistant, anti-static, fire retardant, buffering, no toxic, odorless, no corrosion, no stimulation, heat conducting silica gel.•Packed with 100 thermal pads, Pre-cut pads for easy placement. Size: 12mm * 12mm * 1.5mmEasy Installation1. Remove the old heat-conducting material, clean the surface2. Tear off the protective films on both sizes3. Exert certain pressure to make it with good contacts with both surfaces